1/4 rev. a structure: silicon semiconductor integrated circuits product: stereo class d speaker amplifier type: BD5451EFV package: htssop-b28 features: 1) this ic has one system of digital audio interface . (i 2 s format sdata: 16 / 20 / 24bit lrclk: 32khz / 44.1khz / 48khz bclk: 64fs(fixed) mclk: 256fs(fixed)) 2) low supply current at reset mode. 3) the decrease in sound quality because of the chan ge of the power supply voltage is prevented with the feedback circuitry of the output. in addition, a low noise and low distortion are achieved. eliminate large electrolytic-capacitors for high performance of power supply rejection. 4) s/n of the system can be optimized by adjus ting the gain setting among 2 steps. (20db / 26db) 5) available for monaural mode. 6) within the wide range of the power supply voltage, it is possible to operate in a single power supply. (10 18v) 7) it contributes to miniaturizing, making to the thin type , and the power saving of the system by high efficiency and low heat. 8) eliminates pop noise generated when the power supply goes on/off, or when the power supply is suddenly shut off. high quality muting performance is realized by using the soft-muting technology. 9) this ic is a highly reliable design to which it has various protection functions. (high temperature protection, under vo ltage protection, output short protec tion, output dc voltage protection and clock stop protection, (mclk, bclk, lrclk) 10) small package (htssop-b28 package) contributes to reduction of pcb area. absolute maximum ratings (ta=25 ) item symbol limit unit conditions supply voltage vcc 22 v pin 14, 15, 16, 27, 28 1 2 power dissipation pd 3.3 w 3 4.7 4 input voltage v in -0.3 4.5 v pin 1 6, 13 1 terminal voltage 1 v pin1 -0.3 7.0 v pin 8, 11, 12 1 terminal voltage 2 v pin2 -0.3 4.5 v pin 9 1 terminal voltage 3 v pin3 22 v pin 17, 18, 20 23, 25, 26 1 open-drain terminal voltage v err -0.3 22 v pin 10 1 operating temperature range topr -25 +85 storage temperature range tstg -55 +150 maximum junction temperature tjmax +150 1 the voltage that can be applied reference to gnd (pin 7, 19, 24). 2 do not, however exceed pd and tjmax=150 . 3 70mm70mm1.6mm, fr4, 2-layer glass epoxy board (copper on bottom layer : 70mm70mm) derating in done at 26.4mw/ for operating above ta 25 . there are thermal via on the board. 4 70mm70mm1.6mm, fr4, 4-layer glass epoxy board (copper on bottom layer : 70mm70mm) derating in done at 37.6mw/ for operating above ta 25 . there are thermal via on the board.
2/4 rev. a operating conditions (ta=25 ) item symbol limit unit conditions supply voltage v cc 10 18 v pin 14, 15, 16, 27, 28 1 2 minimum load impedance r l 3.6 ? v cc Q 18v 5 3.2 v cc Q 16v 5 5 do not, however exceed pd. no radiation-proof design. electrical characteristics unless otherwise specified ta=25 , v cc =12v, f=1khz, r l =8 ? , rstx=3.3v, mutex=3.3v, gain=20db, fs=48khz, output lc filter l=10 h, c=0.1 f item symbol limit unit conditions min typ max total circuit circuit current (reset mode) i cc1 - 0.1 0.2 ma pin 14, 15, 16, 27, 28 no load, rstx=0v, mutex=0v circuit current (mute mode) i cc2 - 15 25 ma pin 14, 15, 16, 27, 28 no load, rstx=3.3v, mutex=0v circuit current (sampling mode) i cc3 - 50 80 ma pin 14, 15, 16, 27, 28 no load, rstx=3.3v, mutex=3.3v open-drain terminal low level voltage v err - - 0.8 v pin 10, i o =0.5ma regulator output voltage 1 v reg_g 4.7 5.0 5.3 v pin 11 regulator output voltage 2 v reg_3 3.0 3.3 3.6 v pin 9 high level input voltage v ih 2.0 - 3.3 v pin 1 6, 13 low level input voltage v il 0 - 0.9 v pin 1 6, 13 input current (input pull-down terminal) i ih 50 66 95 a pin 1 6, 13, vin = 3.3v speaker output maximum output power 1 p o1 - 10 - w thd+n=10%, gain=20db 6 maximum output power 2 p o - 15 - w vcc=15v, thd+n=10%, gain=26db 6 voltage gain g v20 19 20 21 db po=1w, gain=20db 6 g v26 25 26 27 db po=1w, gain=26db 6 total harmonic distortion thd - 0.07 - % p o =1w, bw=20 20khz 6 crosstalk ct 66 80 - db p o =1w, bw=ihf-a 6 psrr psrr - 70 - db vripple=1vrms, f=1khz 6 output noise voltage (sampling mode) v no - 100 200 vrms dbfs, bw=ihf-a 6 pwm sampling frequency pwm1 - 256 - khz fs=32khz 6 pwm2 - 352.8 - khz fs=44.1khz 6 pwm3 - 384 - khz fs=48khz 6 6 these items show the typical performance of devic e and depend on board layout, parts, and power supply. the standard value is in mounting device and parts on surface of rohm?s board directly.
3/4 rev. a package outline block diagram pin no., pin name pin no. pin name 1 rstx 2 mutex 3 sdata 4 lrclk 5 bclk 6 mclk 7 gnda 8 filp 9 reg3 10 error 11 reg_g 12 fila 13 gain 14 vcca 15 vccp2 16 17 out2p 18 19 gndp2 20 out2n 21 22 out1n 23 24 gndp1 25 out1p 26 27 vccp1 28 BD5451EFV lot no. (unit: mm) pkg: htssop-b28 drawing no: ex199-5002-1 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 14 10 11 12 13 25 24 23 28 27 26 filp reg3 gnda vcca i/f i 2 s i/f under voltage protection over voltage protection clock stop protection high temperature protection driver fet 1p driver fet 1n driver fet 2p driver fet 2n pwm modulator gndp1 vccp1 8 over sampling digital filter gndp2 vccp2 reg_g gain selector output short protection output dc voltage protection gnda feedback feedback feedback feedback fila
4/4 rev. a notes for use 1 ) absolute maximum ratings use of the ic in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in ic damage. assumptions should not be made rega rding the state of the ic (s hort mode or open mode) when such damage is suffered. a physical safety measure such as a fuse should be implemented when use of the ic in a special mode where the absolute maximum ra tings may be exceeded is anticipated. 2 ) power supply lines as return of current regenerated by back emf of output coil happens, take steps such as putting capacitor between power supply and gnd as a electric pathway for the regenera ted current. be sure that there is no problem with each property such as emptied capacity at lo wer temperature regarding electrolytic ca pacitor to decide capacity value. if the connected power supply does not have suff icient current absorption capacity, r egenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. it is recommended to implement a ph ysical safety measure such as the insertion of a voltage clamp diode between the power supply and gnd pins. 3 ) gnd potential pin 7, 19, 24 . any state must become the lowest volt age about gnd terminal and vss terminal. 4 ) input terminal the parasitic elements are formed in the ic because of th e voltage relation. the parasitic element operating causes the wrong operation and destruction. ther efore, please be careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than gnd and vss. please do not apply the voltage to the input terminal when the power-supply voltage is not impressed. 5 ) setting of heat use a thermal design that allows for a sufficient margin in light of the power dissipat ion (pd) in actual operating conditions. this ic exposes its frame of the backside of package. note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation effi ciency. try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. class d speaker amplifier is high efficiency and low heat generation by comparison with conventional analog power amplifier. however, in case it is operated continuously by maximum output power, power dissipation (pdiss) may exceed package dissipation. please consider about heat design that power dissipation (pdiss) does not exceed package dissipation (pd) in average power (poav). tjmax maximum junction temperature=150 , ta peripheral temperature[ ], ja thermal resistance of package[ /w], poav average power[w], efficiency package dissipation : pd w = tjmax - ta ja power dissipation : pdiss w = poav 1 - 1 6 ) actions in strong magnetic field use caution when using the ic in the presence of a strong magnetic field as doing so may cause the ic to malfunction. 7 ) thermal shutdown circuit this product is provided with a built-in thermal shutdown circuit. when the thermal shutdown circuit operates, the output transistors are placed under open st atus. the thermal shutdown circuit is pr imarily intended to shut down the ic avoiding thermal runaway under abnormal conditions with a chip temperature exceeding tjmax = 150 . 8 ) shorts between pins and misinstallation when mounting the ic on a board, pay adeq uate attention to orientation and placem ent discrepancies of the ic. if it is misinstalled and the power is turned on, the ic may be damaged. it also may be damaged if it is shorted by a foreign substance coming between pins of the ic or betwe en a pin and a power supply or a pin and a gnd. 9 ) power supply on/off pin 14, 15, 16, 27, 28 in case power supply is started up, rstx pin 1 and mutex(pin 2) always should be set low. and in case power supply is shut down, it should be set low likewise. then it is possible to eliminate pop noise when power supply is turned on/off. and also, all power supply terminals should start up and shut down together. 10 ) error terminal pin 10 a error flag is outputted when output short protection and dc voltage protection in the speaker are operated. these flags are the function which the condition of this product is shown in. 11) precautions for spealer-setting if the impedance characteristics of the speakers at high-frequency range while increase rapidly, the ic might not have stable-operation in the resonance frequency range of the lc-filter. therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker.
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